EPCmail_3 - Electronic Newsletter - Mid July
European PCB Convention - Wiesbaden - Germany - September 29th to October 1st
Along with the tens of thousands of ³Convention News² being sent out, the EPC Event Management team is producing a more regular update of progress on the show to be distributed digitally. This document provides up to the minute data and is circulated to anyone wishing to receive it.
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------------------------------ FOR MORE INFORMATION -----------------------------------
If you would like more information or just a chat about the European PCB Convention please feel free to call, fax, or Email Philip Stoten, the Event Manager:
Philip Stoten, Event Manger, European PCB Convention
4 Winship Road, Milton, Cambridge, CB4 6BQ, United Kingdom
Tel: +44 1223 423308 - Fax: +44 1223 423371 - Email: [log in to unmask]
------------------------- A World Class Conference Programme ---------------------
EPC 98 - EUROPEAN PCB CONVENTION
TECHNICAL CONFERENCE PROGRAMME
Not since last World Convention in May 1996, has Europe hosted a large-scale international technical conference on PCB technology. Conferences of this kind are extremely useful for the European industry. They offer managers and engineers a unique opportunity to get up to date on the latest technology and market issues in just a few days.
Large conferences also provide a window for European innovation and in provide a technology exchange forum where all involved in the interconnection and packaging industry can meet and interact.
During the Wiesbaden Convention, our goal was to organize a technical conference that would complement a successful and foccussed trade show. Unlike traditional exhibitions where conferences often play a secondary role, we see EPC as a "Complete PCB Event", where conferences, workshops and exhibition enrich mutually without competing with each other.
Drawing from EIPC's experience in the organisation of technical conferences and seminars, we have put together more than 42 lectures divided in 14 sessions. As well as this half day workshops will allow participants to tackle specific issues in a more interactive way.
It is with gratutude to the Technical Committee, that we are able to offer this World class programme to EPC visitors.
Many thanks to Alain Bardet, William Burr, Lars Jensen, Ewald Losert, Walter Schmidt, Peter Starkey, Joan Tourné, Michael Weinhold and Joachim Zimmermann.
Enjoy EPC 98 and see you in Wiesbaden!
----------------------------- Conference Details --------------------------------
Language
Papers will be presented in English and simultaneously translated into German, Italian and French. In a few cases where papers are presented in German, simultaneous translation will be provided into English.
Our team of translators has accumulated many years of experience in PCB technology.
Seven Workshops will be held of which five will be in Englishand two in German. No translation is provided for workshops.
Papers available in the proceedings are written in English.
---------------------- Conference Prices ----------------------------
(EFIP members include EIPC, VdL, PCIF and CEMA members)
1 day ticket:
DM 390 for EFIP members
DM 490 for non members
includes: One-day conference participation, one copy of the proceedings, coffee breaks.
2 days ticket:
DM 720 for EFIP members
DM 890 for non members
includes: Two days conference participation, one copy of the proceedings, coffee breaks.
3 days ticket:
DM 960 for EFIP members
DM 1190 for non members
includes: Three days conference participation, one copy of the proceedings, coffee breaks.
Workshops/forums
DM 200 for EFIP members
DM 250 for non members.
Proceedings
Proceedings are included in the conference price.
DM 150 per additional copy
Posters
Posters can be displayed in the foyer of the conference. Posters are especially intended for companies presenting papers and for companies whose abstracts did not get into the conference programme.
DM 400 per poster for EFIP members
DM 500 for non members
Deadline for poster application is August 10, 1998. Please check the registration form if you wish to order a space for your poster.
---------------- Technical Programme - EPC 98 -------------------
Tuesday morning, September 29, 1998
Opening Session
"Worldwide trends in the electronic interconnection industry"
09.30 Introduction: William Burr, President of EIPC, I
09.40 Keynote Speaker: Robert Mills, Viasystems Group Inc., USA
"Robert Mills is President of Viasystems Group Inc. In just a few years, he has managed to build one of the world's largest PCB companies by bringing together some of North America's and Europe's finest PCB manufacturers. This achievement marks one of the fundamental trends in our industry and is an appropriate topic for the opening session of this first European PCB Convention.
10.15 Taina Vainio , Nokia Mobile Phones, FIN
Sourcing Stategies for Accelerated Time-to-Market in the High-End Telecom Market
Taina Vainio is Nokiaıs Purchasing Manager responsible for Global Sourcing of PCBıs. Her message is of critical importance to the European Interconnection and Packaging industry. In her presentation, she will analyse the reasons why Europe still retains some competitive advantages over other areas of the World in the highly competitive PCB business.
11.00 Show opening
Tuesday afternoon
A) Process track
Session 1: High Density Pattern Processing
Chairman: Dieter Weiss, Dielektra, D
14.00 - 14.25
Walter G. Hertlein, Shipley Europe, UK
Performance and Limits of Photolithography.
Photoresist coatings applied in liquid form directly onto substrates are widely used in the mass production of innerlayers, chemical milled parts, printing plates and so on. This paper describes how miniaturization of electronics will drive improvement plans for the photolithographic process and outlines new working procedures, equipment and tools for the future.
14.30 - 14.55
Karl H. Dietz, DuPont Photopolymer, USA
Trends in Photoresist Technology.
Performance requirements for dry film photoresist are impacted by new needs. This paper addresses performance interdependecies between resist features and new copper foils, surface treatments, high intensity exposure, laser direct imaging, development chemistry, etch speed and etch factor, resist stripping and disposal requirements.
15.00 - 15.25
Manfred Cygon, Isola AG, D
What Does High-Density interconnection mean for a PCB Manufacturer?
In addition to finer conductors, closer distances and increasingly thin dielectrics, HDI also include extremely small holes, known as micro vias. Improved, and in some case innovative base materials must be developed in order to meet those new challenges. The paper describes the most important properties of those base materials and reports on experience acquired to date with materials for HDI.
15.30 - 15.45 Coffee break
Session 2: Laser Direct Imaging
Chairman: Graham Hardwick, CEMA, UK
15.45 - 16.10
Shavi Spinzi & Werner Eschke, Orbotech Ltd & Laser Imaging Systems GmbH, D
Laser Direct Imaging-Technology and Reality.
Laser Direct Imaging Systems for PCBs are conceptually as simple as the laser printer on your desk. Why then is it so difficult to make them as cost effective as their smaller cousins?
16.15 - 16.40
Mats J. Ehlin, DuPont Photopolymer, USA
High Speed Photoresists for Laser Direct Imaging: Meeting the Needs of the New Century?
Advances in laser and resist technologies have now laid the foundation for a viable system that appears to finally be changing the way PCB's are made. This paper highlights the cost/benefits of LDI and describes the processing of a high speed aqueous dry film resist in an argon ion UV laser.
16.45 End of session
B) Design and Data Transfer Track
Session 3: DFM
Chairman: Joan Tourné, Viasystems Echt, NL
14.00 - 14.25
Nokia Mobile Phones, Lars Buus Jensen, DK
Application of DFM to Real-life Situations in the Fast-Changing World of Mobile Telecom.
When designing mobile phones, time to market, fast turnaround times in development and early involvement are important parameters to success. By implementing DFM throughout the whole design phase, PCBıs are turned into reliable components. This paper shows how DFM has been implemented in NMP by looking at a real-life case.
14.30 - 14.55
Wilhelm Lobner, AT&S, A
Optimization of the Design Process from the Viewpoint of a PCB Manufacturer.
In this paper, design recommendations are being discussed with the help of frequently occurring design errors. The compliance with these recommendations would have very helpful effects, such as the reduction of postprocessing efforts connected with an increase of production yield and a shortage of lead-time.
Session 4: Design and CIM
Chairman: Klaus Jahn, VdL, D
15.00 - 15.25
Lut de Maertelaere, Barco - ETS Division, B
How Internet Technologies Impact The Global Electronics Manufacturing Chain.
The increasing availability of internet access using browsers is changing traditional business methods in the electronics-manufacturing world. This paper explores the world of internet and intranet technologies and present facts and figures on current and future usage.
15.30 - 15.45 Coffee break
15.45 - 16.10
Mehul Davé, Cimnet, USA
Computer Integrated Manufacturing (CIM)
Traditionally, the bottleneck in PCB manufacturing has been production. No longer. Now, information is the bottleneck. This paper presents the business case for using CIM as a tool for gaining a sustainable competitive advantage.
16.15 - 16.40
Peter Straub, PPC Electronic, CH
Thermal Management for PCBs
The paper shows cost-effective ways to transfer heat from the dissipating components through the PCB to a cold wall. The idea is to remove the required complicated and expensive heatsinks and to concentrate on the thermal path of the PCB. The paper will show cost-effective MLB construction with anodized aluminum and thermally conductive dielectric (Prepreg).
16.45 End of session
------------------------------------------------------------------------------------------------------------
Wednesday morning
September 30, 1998
A) Microvia Track (part 1)
Session 5: Microvia fundamentals
Chairman: Erich Kirchner, STP, D
08.30 - 08.35 Introduction
08.40 - 09.05
Philip Britton, DuPont International, CH
Competitive High Density Interconnect PWB Manufacture.
This paper will critically review the global development of micro-via technology from both market and technical aspects. Major technology options for the volume production of micro-vias will be evaluated, the advantages and limitations will be examinated in detail and specific applications will be highlighted.
09.10 - 09.35
Bernhard Sailer & Norbert Münzel, Ciba Specialty Chemicals, CH
New Dielectric Materials for Micro Via-Technology.
Microvia technology is going to be the next technology leap for PCB fabrication. Dielectric materials to cope with that fast improving technologies, for both, photovia and laser, have to be developed and improved. This paper deals with the performance requirements for these dielectric materials, with emphasis on processing, chemical, mechanical and electrical performance.
09.40 - 10.05
Martin Cotton, Viasystems, UK
Micro Features.
Micro vias have been with us for a few years, processed in differing ways, but essentially the same physical technology. This paper shows alternatives to micro vias - Micro Features that have better thermal and electrical performance than înormalî micro vias configurations and most importantly lower processing costs.
10.10 - 10.25 Coffee break
10.25 - 10.50
Thomas Hoffmann, Andus Electronic, D
Photosensitive Dielectrics for New SBU Technology
A few years ago, IBM Yasu opened the way for new SBU technology by using solder resist as dielectric material between layers. This paper explains how the technical limitations of this early technology could be overcome through a completely new process. The paper also reviews the technical capabilities of several alternative materials used as permanent dielectric.
10.55 - 11.20
Kathleen Nargi-Toth, Enthone-OMI, UK
Fabricating High Density Interconnect Structures (HDSI).
Traditional PWB laminates such as FR-4 and BT epoxy resins are being used at the platform for chip scale packages designed with motherboard interfacing styles including PGA, BGA or SMT mezzanine style connectors. These products are growing in global demand. This paper will discuss some manufacturing methods which can be used to produce High Density Interconnection Structures (HDIS) such as the laminate chip carriers and complex PWBs.
B) Manufacturing track
Session 6: Advanced Processes
Chairman: Michael Weinhold, DuPont de Nemours, CH
08.30 - 08.35 Introduction
08.40 - 09.05
Horst Kober, Freudenberg-Metek, D
Is Reel-to-Reel Manufacturing the Right Technology for Fine-Line and HDI to Improve Yields?
Poor yields in HDI manufacturing often result from bad handling of thin-substrates, absence of cleanroom conditions or registration mistakes in the lamination phase. This paper describes how reel-to-reel technology borrowed from high volume flexible circuitry making could be successfully applied to improve yields in PTH/MLB manufacturing. Todayıs state-of-the-art reel-to-reel technology will be reviewed and further developments analysed.
09.10 - 09.35
Scott Hay, QLP Printed Circuits, USA
Continous Foil Lamination.
The ADARA-System is a revolutionary technique for lamination of multilayer and basematerial. This technique employs an endothermic heating method by passing electrical current through continuous copper foil. This paper reports user experience in the US with this new technology.
09.40 - 10.05
Jaques Riguidel, Philips Evreux, F
Experiences after One Year Implementation of Liquid Photo Resist for Innerlayer Production.
This paper makes a specific approach of the process and equipment, of the quality tools used, as well as of teamwork involving suppliers, operators and technicians. Results are analysed in term of quality, yield, implementation and productivity.
10.10 - 10.25 Coffee break
Session 7: Quality Control
Chairman: David Heywood, Isola, UK
10.25 - 10.50
Paul R. Waldner, Multiline International, D
Multilayer Registration, Material Movement and Tracking them Both.
As innerlayers get thinner, multilayers get more layers and pad-to-hole relationship get smaller, it is more and more difficult to keep yields up and costs down. This paper will present an overview of the processes that have an impact on registration.
10.55 - 11.20
Octavian Iordache, Viasystems Canada, CDN
Can Accelerated Stress Tests be "Lingua Franca" for PCB Reliability.
This paper examines the life predictions and the correlation of different reliability tests, with special emphasis on AST (accelerated stress test). It proposes to adopt AST as a "lingua franca" for reliability tests allowing to correlate thermal cycle fatigue tests and thermal shocks to make fast reliability predictions and to design boards self-adaptive to thermal stress.
11.30 - 14.00 Visit to the show
Wednesday Afternoon
A) Microvia track (part 2)
Session 8: Microvia Hole Formation
Chairman: William Burr, Lares Cozzi, I
14.00 - 14.25
Ralf Schmidt & Konrad Wundt, Multiline International, D
Fundamentals of Laser Drilling
This paper describes the principles of the various lasers available on the market, the technical parameters and the need of optical systems such as galvanometer based oprical scanner and telecentric lenses. The interaction of the UV- and/or IR-radiation with materials, the influence of energy and temperature in relationship to the optical parameters, the formation of plasma fume and its interaction with laser light are also discussed.
14.30 - 14.55
Mr. Kersten, Botz, Feufel & Mr. Biernaux, Morrison, Kital - Photo Print Elektronik GmbH, D & Lumonics, CDN
A Flexible Production Laser System for Blind Vias Drilling.
Laser drilling systems have improved in throughput over the last two years and as fabricators develop close relationships with the laser system suppliers, better laser drilling systems emerge. This paper discusses implementation of such a system resulting from the inputs of a well respected blind vias fabricator. Details will be provided on compatible materials and processing speeds.
15.00 - 15.25
Larry Burgess & Fabrizio Pauri, Laser Via, USA & Pluritec, I
Defining the Production Role of Laser Technology in PCB Fabrication into the Millennium
Today seven, maybe more, laser systems have been introduced into the circuit board industry. Each of this systems has clear strengths and weaknesses. This paper will describe the strengths and weaknesses of all the known systems.
15.30 - 15.45 Coffee break
15.45 - 16.10
Eddy Roelants, Siemens AG, D
Hole Formation Using Alternative Technologies for the Manufacturing of Advanced Mocrovia PCBıs.
The -multiple overlaid viasì technology was developed as an answer to OEMıs growing needs for High Density Interconnection. This paper presents the fundamentals of this revolutionary method to manufacture microvias which combines laser drilling of blind vias and printing of resistors.
16.15 - 16.40
B. Kegel & R. Naversnik, Technics Plasma GmbH, D
Advantages of Low Pressure Plasma Etching in Addition to the Formation of Microvias.
This paper describes some basics and process aspects about LP-plasma application in polymer etching. Various application areas for the plasma processing and a number of concrete examples will be shown. Future developpments will be discussed.
16.45 End of session
B) Management Track
Session 9: Management
Chairman: Walter Schmidt, Dyconex AG, CH
14.00 - 14.25
Ernst König, AIK Laminate GmbH, D
Competitive Solutions in a Strongly Global Environment.
The Consumer Electronics industry is today under tremendous cost pressures. This paper dicusses the most important success factors for participating in a global competition. The described examples are taken from the latest developments of a Paper Laminates company in a globally strong competition in the Consumer Electronics area.
14.30 - 14.55
Juergen Dold, DMG & Erhard Marek, Elekonta Marek GmbH, D
How to Survive in a Fast Changing Market as a Small Company?
German small and medium size businesses are struggling in a difficult environment: high cost of labor, downward price pressures, reducing cycle times. This paper analyses the different strategies, based on real life situations, that are applicable to those companies in order to remain profitable in the coming years.
15.00 - 15.25
Jarmo Niemi, Aspocomp, FIN
Key Success Factors and Challenges for the High-End PCB Shop of the Future.
This paper will focus on key success factors for high-end PCB manufacturers in the coming period. After an introduction on business cycles, critical items such as reduced time-to-market and investment strategies will be discussed.
15.30 - 15.45 Coffee break
Session 10: World Markets
Chairman: Edwald Losert, Ciba-Geigy, CH
15.45 - 16.10
Dr. Hayao Nakahara, N.T. Information Ltd., USA
What Is Happening In Asia Pacific?
More than ever and despite recent crisis, Asia is playing a leading role in the PWB industry. This paper attempts to analyse the current status of the PWB industry in Asia Pacific and predicts what may happen in the near term future.
16.15 - 16.40
Charles E. Bauer, TechLead Corp., USA
Market Drivers and Expectations in Advanced Interconnect Structures
Four years ago, almost no-one was aware of the existence of Microvia technology. The fast changing PCB world is such that hardly anybody can ignore it today. What are the market drivers behind microvia demand? What is coming next as an answer to OEMıs increasing requirements for miniaturization and how will it impact PCB manufacturers? Those are some of the questions which this paper will analyse and answer.
16.45 End of the session
------------------------------------------------------------------------------------------------------------
Thursday morning
October 1, 1998
A) Process Track
Session 11: Plating
Chairman: Dieter Bergman, IPC, USA
08.30 - 08.35 Introduction
08.40 - 09.05
M. Ward, D.R. Gabe & J.N. Crosby, Loughborough University & Lea Ronal, UK
Novel Agitation for PCB Production: Use of Eductor Technology.
Metal distribution on PCB's exhibits two main problems: over-board thickness variations and trough-hole thickness uniformity. This paper shows results which indicate that using this technology, improved thickness distribution across boards and enhanced deposition rates are possible.
09.10 - 09.25
Richard C. Retallick, MacDermid Inc., USA
Periodic Pulse Reverse Plating
Traditionally, the acid copper plating process has been the bottleneck at many PCB manufacturing facilities, as higher technology required increased plating times. This paper presents the periodic pulse reverse plating technology and describes installation and qualification of this process, which allows processing of high aspect ratio holes with high current densities, while enabling higher productivity.
09.30 - 09.55
Olaf Johann, Würth Elektronik AG, D
Concept and Realisation of a Complete Automation of the Direct Plate Process.
Direct plating equipment is now installed in a majority of Europeıs leading PCB manufacturing facilities. This paper describes installation and full automatisation of such a direct plate line in a hi-tech German PCB company. Automatisation of the line operation, bath installation, cleaning procedure could result in improved process stability and equipment availability.
10.00 - 10.15 Coffee break
Session 12: Metal finishing
Chairman: Joachim Zimmermann
Robert Boasch, D
10.15 - 10.40
Xavier Batteux, Alpha Metals, F
The Revolutionary Alternative to Hot Air Levelling
Although solderable finishes is a field which has experienced tremendous developments in recent years with the introduction of silver and palladium, the most common finishes supplied by PCB manufacturers are still hot-air-solder-levelling, electroless nickel, immersion gold and OSPs. Each of these may exhibit problems if not correctly applied. This paper presents a new silver base finish compatible with current and future technologies & materials.
10.45 - 11-10
Nick Howland, Paul Hoath & Gary Morse, Enthone - OMI & Vero Electronics, UK
OSP and the Pressfit Connection.
Traditional finishes have always been a problem for backplanes and tests have been carried out in the past using alternative finishes with little success. A programme of in-depth testing was performed by a backplanes manufacturer to establish the suitability of organic solderability preservatives (OSP) with this type of mixed technology. This paper presents the results of those tests and describes the subsequent installation and first results of a horizontal conveyorized OSP system.
11.15 - 11.40
Helmut Bruckner, Cimatec GmbH, D
Three Years User Experience with a New Tin Process.
As a case history, this paper presents in details the pretreatment of the copper surface, the growth of the intermetallic Cu/Sn phase, the formation of oxided surfaces on chemical tin and the influence of PCB materials (base material, lacquers, adhesives) on the solder bath.
B) Technology track
Session 13: Test and AOI
Chairman: Hans Pietruschka, Bare Board Test Working Group, D
08.30 - 08.35 Introduction
08.40 - 09.05
Richard Frisk, Lloyd Doyle Limited, UK
The Inspection of BGA Panels at Bare Board Stage.
The production of BGA type intermediate device carriers involves the manufacture of small, individual circuits on a larger multi-circuit panel. These large panels may contain up to 120 of small individual circuits. The testing of these panels is today fraught with difficulty or even impossible. This paper presents an alternative test method for those BGA panels based on AOI technology. The method enables to detect defective panels quickly and accurately, giving live feedback to production departments.
09.10 - 09.25
Uwe Rothaug, ATG test systems GmbH, D
Flying Probe - Bed of Nails - Which Test Principle is Useful for which Application?
This paper intends to figure out for which kind of product (including number of products, complexity of products, surface of products..) it makes sense to use which kind of test strategy (either flying probe or bed of nails). The paper also describes some new approaches to overcome the drawbacks of existing test principles.
09.30 - 09.55
Jake Kelly, Viking Test Systems, UK
High Volume Testing of High End PCBıs
This paper reports about new testing technology combining dedicated style of fixturing, which eliminates the density issue which causes many problems on the more widely used universal systems, and non-contact test technology for testing MCM's, MBGA's & FCP substrates.
10.00 - 10.15 Coffee break
10.15 - 10.40
Mario Cugini, Fastek, USA
Non Contact Bare Board Test
This paper describes a new process technology which identifies opens and shorts in PCB's without the need for fixtures. It functions from Net List, at production rates, with SMD pitches down to 100 microns, and leaves no marks. Estimated product throughput is four PCB's per minute, at 1'000 test points per PCB.
Session 14: Environmental issues
Chairman: Brian Haken, PCIF, UK
10.45 - 11-10
Martin Goosey, EFIP environmental Group
The Impact of Environmental Issues on the European PCB Industry.
This paper reviews the impact of environmental issues on the European industry, details progress made to date by the Environmental Working Group and discusses future plans for extension of this work throughout Europe.
11.15 - 11.40
A.M. Celi, In.Tech. Environment Technology GmbH, D
Recovering Etching Agents and Metals out of Etching Solutions.
This paper describes an equipment concept to recover fully automatically etching agents by extraction, re-extraction and through an electrolytical separation of metals from etching solutions in an environmental friendly manner.
11.45 End of the session
---------------- Workshops allow EPC Visitors to influence their industry --------------
The team at EPC are delighted to be able to offer such an extensive workshop programme at this coming European PCB Convention in Wiesbaden this Autumn.
Workshops represent a unique opportunity for delegates to influence the future in which they work. The workshops are chaired by leading technologists from within the industry and are expected to provide a lively forum for debate. The importance of workshops should never be underrated in an industry moving as fast as PCBs.
To get more details about the workshops or to obtain information about taking part, contact Eric Toumieux at the EIPC or Philip Stoten at the EPC Event Managers office.
Workshop titles include:
Future Bare Board Test Solutions for High Density Interconnects
ISO 14001 - A Challenge for the European PCB Industry
Metal Finishing (in German)
Effective Design to Manufacture Data Transfer
Alternative Materials for HDI PCBıs with Microvia Technology. (in German)
Laser Drilling Technology
Laser Direct Imaging
--------------------
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