I have yet to experience (that I know of), any failures due to
voiding. We have done thermal cycling (no vibe) on a few
assemblies that have BGA's, but no HALT.
Haven't assembled anything with BGA's with a water soluble
flux, we use no-clean (Indium SMQ-92J).
Kind regards,
-Steve Gregory-
Senior Process Engineer
LaBarge Incorporated
Tulsa, Oklahoma
(918) 459-2285
(918) 459-2350 FAX
"Tempea, Ioan" <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
10/18/2005 07:31 AM
Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to "Tempea, Ioan" <[log in to unmask]>
To: [log in to unmask]@SMTP@Exchange
cc: (bcc: Stephen R Gregory/LABARGE)
Subject: Re: [TN] Voids in BGAs, again
Concur with Richard,
good document, professional and academic. But if I am not mistakening, it does not mention real failures from voiding.
BTW, your experience is very well appreciated, extreme conditions, bad voids. I am wondering if regular testing, like HALT and the others caused joints to fail due to voiding.
What about failures due to chemistries, WS flux entrapped into voids that corrode their way out?
Best regards,
Ioan
> -----Original Message-----
> From: TechNet [SMTP:[log in to unmask]] On Behalf Of Stadem, Richard
> Sent: Tuesday, October 18, 2005 8:14 AM
> To: [log in to unmask]
> Subject: Re: [TN] Voids in BGAs, again
>
> Thank you Steve!
> This is an excellent and informational document. Thank you for posting
> it.
>
>
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