Join IPC, in February 2008, in Phoenix, AZ!
Fundamentals of Printed Circuits - Materials, Structures and Processes
February 12, 2008 - Phoenix, AZ
8:30 am - 5:00 pm
Instructor: Joseph Fjelstad, Verdant Electronics
PCBs are the electrical interconnection platform for nearly every
electronic product. This tutorial provides a detailed overview of this
indispensable technology. It reviews the materials and processes that
comprise the wide array of electronic interconnection substrates used
today - and explains why they were chosen. You will learn about
multilayer, metal core, embossed, flexible and rigid-flex circuits and
much more. Discussions will also include newer HDI/microvia and embedded
passives technologies, new PCB design concepts and a brief look at the
impact of lead free on PCB manufacturing. Join us for this tutorial, and
benefit from a solid overview of key fundamentals.
Desmear Metallization and Plating of Flex & Rigid Flex Printed Wiring
Boards
<http://www.ipc.org/calendar/2008/Interim_Meeting_Workshops_02_12_08/Int
erimWorkshops02.12.08.htm#Desmear>
February 14, 2008 - Phoenix, AZ
8:30 am - 11:30 am
Instructor: Michael Carano, Electrochemicals, Inc.
Understanding the intricate nature of materials and processes is
critical to ensuring highly reliable performance of printed wiring
boards. In this workshop, you will gain insights and get recommendations
on the desmear and metallization of flexible, rigid-flex and
high-performance rigid materials. Direct metallization will be compared
and contrasted to conventional electroless copper systems. Best
practices with respect to imaging and electroplating of metallized
substrates will be discussed in detail. Surface-finish issues will be
discussed in the context of improved solderability. Finally, performance
and process-related issues with respect to liquid photoimageable
soldermasks and flexible coverlayers will be presented. Be sure to join
us for this enlightening workshop!
Advanced Troubleshooting for Printed Wiring Board Manufacturing - Defect
Analysis and Prevention
<http://www.ipc.org/calendar/2008/Interim_Meeting_Workshops_02_12_08/Int
erimWorkshops02.12.08.htm#Advanced>
February 14, 2008 - Phoenix, AZ
1:00 pm - 4:00 pm
Instructor: Michael Carano, Electrochemicals, Inc.
What are the critical success factors for a defect-free PWB fabrication
process and maximum long-term reliability? This course tackles the
answers! Join us for this half-day workshop and gain the
process-technology know-how you need to improve the yield, quality and
reliability of complex printed wiring boards. Emphasis is on identifying
and preventing defects with respect to electroless copper and direct
metallization, electroplating, drilling and multilayer fabrication. The
most common PWB defects will be presented, and corrective action and
preventive steps will be discussed.
Location and Hotel Accommodations
The workshops will take place at the Grace Inn Phoenix, 10831 South 51st
Street, Phoenix, AZ 85044. To reserve your room, contact the hotel
directly at +1-800-843-6010 and ask for the IPC rate of $99
single/double per night. Rate is subject to change after January 7,
2008.
Early Registration - Register by January 14, 2008 and save an additional
10% off the prices shown below or register three individuals from your
company at the same time and receive the fourth registration FREE.
For more information or to register, please cut and paste
www.ipc.org/Interim0208 <http://www.ipc.org/Interim0208> into your
browser and download the registration form.
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