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October 2005

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Subject:
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Wed, 12 Oct 2005 11:18:24 +0200
Content-Type:
text/plain
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text/plain (50 lines)
Hi Kathy,
we have been using Al wedgebonding on ENIG for many years, from 37um wires to 250um.
Works just fine.... if you have a reliable ENIG plater, of course.
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy
Sent: den 11 oktober 2005 21:42
To: [log in to unmask]
Subject: [TN] wire bonding


Question for the assemblers:

When wirebonding to ENIG, do you use any solder paste or other "facilitator"

to create the bond?

Thanks for your reply...










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