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October 2005

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Subject:
From:
Stephen R Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stephen R Gregory <[log in to unmask]>
Date:
Mon, 17 Oct 2005 07:39:18 -0500
Content-Type:
text/plain
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text/plain (194 lines)
                                Mornin' Inge and Everyone!

                                Got your whiskers picture Inge, very remarkable photo! You told me that
                                this was a picture of whiskers inside a waveguide. How did you know they
                                were there?

                                Anyways, go to: http://www.stevezeva.homestead.com and then go to "Picture
                                Page 2", then look for "Waveguide Whiskers".

                                Again, very remarkable image!

                                Kind regards,

                                -Steve Gregory-
                                Senior Process Engineer
                                LaBarge Incorporated
                                Tulsa, Oklahoma
                                (918) 459-2285
                                (918) 459-2350 FAX





        Ingemar Hernefjord <[log in to unmask]>
                        Sent by: TechNet <[log in to unmask]>
                        10/17/2005 05:30 AM
                        Please respond to TechNet E-Mail Forum <[log in to unmask]>; Please respond to Ingemar Hernefjord <[log in to unmask]>
                                	
        To:     [log in to unmask]@SMTP@Exchange
        cc:     (bcc: Stephen R Gregory/LABARGE)
        Subject:        [TN] SV: [TN] Electrolytic Tin Plating	


                                Whisker growth is depending on the base material. Any alloy with Cu and
                                Zn is risky, tin over Ni will not cause much whiskers, Pt and Pd no
                                whiskers at all etc. Reason is that whisker growth is mainly caused by
                                diffusion of e.g. Cu into the tin plate. Cu/Sn IMCs grow and cause
                                stress in the boundaries and. The stress is in the order 40-100 Mpa at
                                the root of the whisker embryo. The unique thing is that this can only
                                be created in a specific range of tin thickness: approx. 2-5 um. 10um
                                thick tin or more is said to produce no whiskers at all, as well as
                                thinner than 2um. Our company together with Bosch and ESA have done a
                                study and made tests, probably the most advanced today to get to the
                                root of the phenomenon, but still there are work to be done. There are
                                many contradictory facts, e.g. two bath suppliers can have 'exactly'
                                same chemicals in their soup, one giving whiskers, the other not. Other
                                questions are about growth speed, where some claim that whiskers can't
                                grow with more than some um/month, while I myself have seen whisker grow
                                to 10 mm length in a couple of weeks! I'll see if I can put a picture up
                                on Steve's wall. Finally, fusion seems to solve all whisker problems,
                                but how do we know that? Who can predict what happens after 5 or 10
                                years.

                                Interesting topic, anyway

                                Ingemar Hernefjord
                                Ericsson Microwave Systems


                                -----Ursprungligt meddelande-----
                                Från: TechNet [mailto:[log in to unmask]] För Franklin Asbell
                                Skickat: den 14 oktober 2005 16:41
                                Till: [log in to unmask]
                                Ämne: Re: [TN] Electrolytic Tin Plating

                                I'm thinking the chemistry involved with electrolytic tin is going to
                                result
                                in whiskers/growth and I would suggest it not be used for a final
                                finish. If
                                you are like many shops you use the tin/lead as an etch resist in
                                process,
                                which is fine, but for final finish immersion tin would be better.

                                Check out Florida Cirtech's website, they have a nice study you can
                                download
                                and print regarding the differences between the two type baths
                                (electrolytic
                                and their Omikron).

                                (and again, this is not an endorsement for any specific chemistry, the
                                site
                                mentioned offers greater volumes of literature is all, and I like my
                                literature)

                                I would think storage would not be an issue with plated tin or tin-lead
                                provided they were sealed properly, but with the plated tin, some
                                humidity,
                                some contamination, and mild current...these are all good conditions to
                                cause growth.

                                And I'm thinking tin will indeed flow, it just takes a higher
                                temperature...

                                Franklin



                                -----Original Message-----
                                From: TechNet [mailto:[log in to unmask]] On Behalf Of Fineline Circuits,
                                Inc
                                Sent: Friday, October 14, 2005 9:20 AM
                                To: [log in to unmask]
                                Subject: [TN] Electrolytic Tin Plating

                                Hi Technetters:
                                Now that Leadfree is here or close to, we would like to change the
                                electrolytic tinlead plating tank to electrolytic tin tank.
                                I would like to know if the other fab houses have done this and if so
                                which
                                vendors tin chemistry has a wider window of operation. Are they seeing
                                any
                                tin whiskers/sliver problems etc..especially if the boards are stored
                                for
                                few months.
                                Also it is my understanding that you can mask over this plated tin since
                                it
                                does not flow. In this case you can totally avoid stripping the tin and
                                tin
                                levelling.
                                We currently do offer other finishes including electroless tin ,
                                immersion
                                nickel/gold, silver....
                                If there are other consideration in making this change I would
                                appreciate
                                your input.
                                Franklin, like you I would like to see more fab houses participating but
                                I
                                would like to remain with technet.
                                Thanks

                                Sona Sitapara
                                Fineline Circuits Inc.

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