In a message dated 8/17/99 12:59:11 PM Central Daylight Time, Robisan1 writes:

<< Hi Steve and all
 The requirements that say a hole does not need to be filled is a fact
 HOWEVER if it is filled it must be at least 75% filled.  This value is
 a result of a great deal of data and was recently re-affirmed by 001.

 The reliability of a hole is the best when either completely (>75%)filled
 or completely empty.  Fill that is inbetween has proven to degrade
 reliability.

 Susan Mansilla
 Robisan Lab >>

Hi Susan,

Okay, let me pose this question to you then; can we reject the boards back to
the vendor? They didn't do anything wrong because the gerbers didn't relieve
the via's in the solder mask layer, and the customer didn't specify that the
via's be tented. So after HASL, some of the vias were plated, and they MAY
wet with solder when I wave the board...there not a real good chance the ones
that do wet will fill any more than 50% because the mask that has gone down
inside the via is 50% down in the hole....so do I spend a bunch of effort
using a temporary mask to cover the via's so there's NO POSSIBILTY of the
via's filling?

Interested to hear your thoughts...

-Steve Gregory-

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################