Ioan,

it depends 

- on the time between application of flux and cleaning
- the type of flux and solderpaste. You have to define the product by 
name, not only by activityclass
- on the type of cleaning system 

Take testboards and do SIR-testing and ionic-testing. 
Think about the various possibilities of processes. Any additional 
solderprocess hardens the flux applied in prior steps. 
Based on the results you can specify the acceptable times between 
application and cleaning.


Regards

Frank

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