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October 2005

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Subject:
Re: wire bonding
From:
Joyce Koo <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Wed, 12 Oct 2005 13:38:43 -0400
Content-Type:
text/plain
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text/plain (100 lines) 
according to my book it is electroless nickel and immersion gold... Not sure
if it is correct or not...jk

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of jrm
Sent: Wednesday, October 12, 2005 1:23 PM
To: [log in to unmask]
Subject: Re: [TN] wire bonding


What is ENIG?

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ingemar Hernefjord
(KC/EMW)
Sent: Wednesday, October 12, 2005 1:18 AM
To: [log in to unmask]
Subject: Re: [TN] wire bonding

Hi Kathy,
we have been using Al wedgebonding on ENIG for many years, from 37um wires
to 250um.
Works just fine.... if you have a reliable ENIG plater, of course.
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy
Sent: den 11 oktober 2005 21:42
To: [log in to unmask]
Subject: [TN] wire bonding


Question for the assemblers:

When wirebonding to ENIG, do you use any solder paste or other "facilitator"

to create the bond?

Thanks for your reply...










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