Hi Charlie! I suggest getting copy of IPC-SM-785 Guidelines for Accelerated
Reliability Testing of Surface Mount Attachments. The document is a good
primer on the impact of reliability testing on solder joints. A good book
reference is "Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine
Pitch SMT Assemblies", Lau and Pao, ISBN 0-07-036648-9 which will prove
helpful. Good Luck.

Dave Hillman
Rockwell Collins
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"<Charles Barker>" <[log in to unmask]> on 06/10/99 08:41:07 AM

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Subject:  [TN] Temp cycling and vibration testing.




Our Engineering depatment is doing some temperature cyclying and vibration
testing (HALT type testing). Can any or you tell where I can get reference
material about the effect this has on the solder joints? Some of the
variables I would like to become knowledgable about are: component height
and mass, joint design, solder alloy variations, effect of reflow profile,
etc.

We will probably be testing over a temp range of -60 to -65  C up to the
neighborhood of +125 C or thereabouts and shock maybe up to 40, 50 or 60
g's.

Are there any "programs" or formulae readily available which will predict
joint failure after so many cycles at certain temps, freqs, and g's?

TIA

Charlie Barker

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