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| Date: | Tue, 11 Oct 2011 08:52:22 -0400 |
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Ditto. This flux is very corrosive. From J-STD-004 H means high activity,
1 means with halide, Mumtaz provided more details. This flux is designed
to be washed off. If ANY moisture gets through the gasket, this circuit
will have problems. Would it be possible to solder this one part with ROL1
or REL1 flux -cored solder wire and no assist flux?
Karen Tellefsen - Electrical Testing
[log in to unmask]
908-791-3069
Re: [TN] ORH1 flux residues
Robert Kondner
to:
TechNet
10/10/2011 08:14 PM
Sent by:
TechNet <[log in to unmask]>
Please respond to rkondner
I would suggest it is VERY bad thing.
If that flux is an ionic material, and I think the H1 indicates it is,
then
you have a serious problem with everything you ever built using that
technique. That flux, remaining on a PCB, and in the presence of a voltage,
will grow all kinds of evil stuff.
I hope someone can tell me wrong.
Bob K.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Monday, October 10, 2011 7:49 PM
To: [log in to unmask]
Subject: [TN] ORH1 flux residues
I have a PWA with a gasket beneath a large thru hole power device.
The gasket has holes punched in it for each of the pins.
The device is hand soldered flush to the PWB.
The operator uses external liquid flux along with core solder with flux in
it.
The assembly is later washed and it passes ionics testing.
The problem is that this gasket effectively seals the top side solder
connections from the cleaning process.
My question is this:
How much should I be worrying about the existing hardware which has flux
residues sealed under the power device?
The assembly is stored with the power off.
The flux used is water soluble and classified as ORH1.
For future builds we are modifying the gasket so that the topside
connections can be cleaned (cutout "u" shape intead of round holes).
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