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November 1999

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Subject:
From:
Mark Ross <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 29 Nov 1999 17:53:37 -0500
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Ed,

We have even put them in the silkscreen when necessary when we did not want
to split the copper plane.  Also We have done them by relieving the solder
mask.  Just some food for thought if you are limited on
size/space/electrical requirements.  However for the UL logo requirements,
re-check the UL spec.  It may have some wording like logo to be permanently
marked on circuit board and permanently may mean you can't destroy it
without affecting the board (i.e. rubbing off the silkscreen etc.).

Mark Ross
Donnelly Electronics


-----Original Message-----
From: Ed Cosper [mailto:[log in to unmask]]
Sent: Monday, November 29, 1999 5:29 PM
To: [log in to unmask]
Subject: Re: [TN] FAB: UL and/or Vendor Logos


There is not typical size.. I suspect it is at your discretion provided it
remains legible .

Ed C.


----- Original Message -----
From: Jack Olson <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, November 29, 1999 4:22 PM
Subject: [TN] FAB: UL and/or Vendor Logos


> Can anyone with fab CAM expertise tell me if there is a typical SIZE for
the
> vendor logo?
> Is there a maximum size?
>
> We prefer them in copper on the back of the board, but sometimes we need
to
> make a little relief in a plane (cut out a rectangle) for the logo.
>
> The question is: How big should the relief or rectangle be?
>
> Thanks in advance,
> Jack
>
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