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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 24 Sep 2001 18:07:26 -0400 |
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Sounds acceptable. There must be evidence of wetting to the barrel as well.
No solder is required on the land. But caution is in order. Can you perform
a test like J-STD-003 4.2.4 Wave Solder Test?
Guy Ramsey
Senior Lab Technician / Instructor
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Peter Crain
Sent: Monday, September 24, 2001 5:13 PM
To: [log in to unmask]
Subject: [TN] Insufficient solder
I need to nail down what an insufficient solder defect is. We are dealing
with through components.
We are seeing good solder fillets on the component side. But, there is a
concave dip 360 degrees around the lead of the secondary side of the
board. - (the solder doesn't fill completely to the top to be level with
the board.) There is a small fillet that goes around the lead 360 degrees.
This is not illistrated in IPC-A-610 wheater is it a defect. Would anyone
else consider this a defect?
Can anyone help clarify?
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