Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 1 Jul 1998 20:04:23 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
If you are trying to "heat sink" the parts, you can increase your copper weight to 3 oz or greater. You
can also reduce your dielectric between the component layer and layer 2. I would recommend that you place
your ground layer on layer 2 to minimize your noise if you do this. You can also increase your layer count
and place a second ground layer in the board. If you do this, use caution as to keep your design
symmetrical to prevent warpage.
If this doesn't work, I would suggest an external heatsink. Good Luck JOHN WAITE
Vaughan, Ralph H wrote:
> Dear PWB fab guys,
>
> Can you provide any news, good or bad, on material used in boards to
> help move heat away from hot parts? We have tried the standard methods
> of leaving unused copper in the board rather than etching it away, and
> using thermal pads under the parts, but my designers think they need
> more thermal conduction through the pwb. If anyone has any experience
> with the thermally conductive pre-pregs, or any other similar material,
> I would appreciate your thoughts.
>
> thanks
>
> Ralph Vaughan
> Boeing-Atlanta
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe: SUBSCRIBE TechNet <your full name>
> To unsubscribe: SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################
|
|
|