TECHNET Archives

July 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John Waite <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Jul 1998 20:04:23 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines)
If you are trying to "heat sink" the parts, you can increase your copper weight to 3 oz or greater.  You
can also reduce your dielectric between the component layer and layer 2. I would recommend that you place
your ground layer on layer 2 to minimize your noise if you do this.  You can also increase your layer count
and place a second ground layer in the board.  If you do this, use caution as to keep your design
symmetrical to prevent warpage.
    If this doesn't work, I would suggest an external heatsink.  Good Luck   JOHN WAITE

Vaughan, Ralph H wrote:

> Dear PWB fab guys,
>
> Can you provide any news, good or bad, on material used in boards to
> help move heat away from hot parts?  We have tried the standard methods
> of leaving unused copper in the board rather than etching it away, and
> using thermal pads under the parts, but my designers think they need
> more thermal conduction through the pwb.  If anyone has any experience
> with the thermally conductive pre-pregs, or any other similar material,
> I would appreciate your thoughts.
>
> thanks
>
> Ralph Vaughan
> Boeing-Atlanta
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2