Hello Brian,
We are trying to find out the source of the white residue we see post wash (to see if ionic cleanliness is an issue). Our concern also is the adhesion of potting and CC if the residue is left on the board assuming it is benign. 

Regards,
Amol



-----Original Message-----
From: Brian Ellis [mailto:[log in to unmask]] 
Sent: Thursday, June 13, 2013 9:36 AM
To: TechNet E-Mail Forum; Amol Kane
Subject: Re: [TN] Titanium

Both ideas are potentially valid. It would be easy to trace the source by EDXing a sample of the raw solder in the machine, as well. I take it the Ti concentration is in the ppm/ppb range. Perhaps your question is really whether small quantities of Ti will affect the reliability of the solder joint? I think not.

On 13.06.2013 17:03, Amol Kane wrote:
> Dear Technetters,
> We are seeing some titanium residues (confirmed by EDX) on solder joints after wave soldering post wash (that is not to say they are not present post wave, more analysis is ongoing). Water soluble process, high lead alloy, and a saponified wash. So far the Ti residues are only detectable on the solder joints, not on the assy surface. For general information. what are some possible sources of Ti on the assembly?
>
> Regards,
> Amol
>
>
>
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