Hi folks,

I have 3 cleaning processes for cleaning assembled printed circuit
assemblies - in-line semi-aqueous, batch vapor degreasing, and good old hand
cleaning with various solvents.

My management is requiring me to develop an SPC application for cleaning.
This application should include the use of variable data (actual measurement
of a parameter rather than pass/fail, good/bad).  The measurement should be
something the average assembler can measure and chart with a minimum of fuss
and muss - in other words, keep it simple and inexpensive.

Right now, the only measurement we can do fairly quickly, is an ionic
contamination test (old Alpha Omegameter).  I realize that this test is
really more qualitative than quantitative even though it produces a number.

I have a few questions of my esteemed colleagues out there in the virtual
factory:
1.      Do any of you have SPC applications on your cleaning systems?  If
so, what are you measuring and how often?
2.      Is this even feasible?

Thank you for any help you can provide.

Kathie Lambert
Process Development Engineer
Northrop Grumman
Baltimore, MD
410-765-9746

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