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November 2005

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Subject:
Re: [LF] Reliability prediction of LF soldering
From:
"Ingemar Hernefjord (KC/EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ingemar Hernefjord (KC/EMW)
Date:
Wed, 16 Nov 2005 19:08:11 -0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (38 lines) 
Werner,
I've asked for permission to share with TN one single pic from our report, that illustrates varying distribution of lead in BGA balls. Hope on 'da'
Inge

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: den 16 november 2005 20:00
To: [log in to unmask]
Subject: Re: [TN] [LF] Reliability prediction of LF soldering


Hi Ingemar,
The one 'good' thing about this lead-free idiocy is that it has put a lot of
people to work, produced all manner of research grants, and just look at all
these thesis topics.

Werner

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