Dear Experts
Can anyone tell what suitable grid settings to use when designing
boards, which have shrink DIP components (70 mil) and standard DIP(100
mil) and SMT components on the same board. I have read that IPC has
announced taking the 0.5mm as a standard grid. But I think this won't be
applicable in our case (isn't it?).
I have read a lot about grid settings, but till now I don't see the
point behind caring so much about it. What problems could occur when you
go down to 0.05mm grid.
BTW we are using 8 mil (track/gap).
Any input would appreciated.

--
Best Regards                                       ```
Khaled H. Fouad                                   (o o)
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