TECHNET Archives

July 2008

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Igoshev, Vladimir" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Igoshev, Vladimir
Date:
Mon, 14 Jul 2008 11:22:36 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Different locations, identical caps placed along and normal to the board. :-)



Regards,



Vladimir



----- Original Message -----

From: Allen Maddox <[log in to unmask]>

To: TechNet E-Mail Forum <[log in to unmask]>; Igoshev, Vladimir

Sent: Mon Jul 14 11:19:16 2008

Subject: Re: [TN] Ceramic caps



Just curious if there is any consistency in the size of the cap or it's place on the board and direction it faces?

It seems like you've covered all the obvious failures so far.

 

Allen Maddox, CID+





"Igoshev, Vladimir" <[log in to unmask]> wrote:



	That was the first thing I asked and was told "No", they hadn't been re-worked or placed manually.

	

	What bugs me the most is that I have a hard time imagining how a top half of a cap can be separated from the bottom one. If it wasn't a manufacturing problem, then how it should have been loaded (mechanically) to crack like that.

	

	Regards,

	

	Vladimir

	

	----- Original Message -----

	From: TechNet 

	To: [log in to unmask] 

	Sent: Mon Jul 14 10:39:57 2008

	Subject: Re: [TN] Ceramic caps

	

	In addition to the very good info you have already received, consider

	how the caps are being soldered or reworked. I would check to make sure

	none were soldered by hand using conventional solder irons. Rework such

	as solder touchup should only be done with a hand-held hot air device

	such as a Hakko or JVC.

	Never, ever allow an MLCCC to be soldered with a conventional soldering

	tool, as the sudden thermal shock will crack the body of the connector,

	and/or the large heat transfer can melt the high-temp solder connections

	internally (plate to terminal connections). 

	

	-----Original Message-----

	From: TechNet [mailto:[log in to unmask]] On Behalf Of Igoshev, Vladimir

	Sent: Monday, July 14, 2008 8:08 AM

	To: [log in to unmask]

	Subject: [TN] Ceramic caps

	

	Hi TechNeters,

	

	I came across an unusual (at least to me) failure mode of ceramic caps.

	They crack along the component body in either normal (from top all the

	way through to the bottom), or parallel (from one side all the way

	through to the other side) direction to the board the caps are mounted

	on.

	

	Has anyone seen something similar?

	

	Thanks a lot in advance.

	

	Regards,

	

	Vladimir

	

	---------------------------------------------------

	Technet Mail List provided as a service by IPC using LISTSERV 15.0 To

	unsubscribe, send a message to [log in to unmask] with following text in

	the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or

	(re-start) delivery of Technet send e-mail to [log in to unmask]: SET

	Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the

	posts: send e-mail to [log in to unmask]: SET Technet Digest Search the

	archives of previous posts at: http://listserv.ipc.org/archives Please

	visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for

	additional information, or contact Keach Sasamori at [log in to unmask] or

	847-615-7100 ext.2815

	-----------------------------------------------------

	

	---------------------------------------------------

	Technet Mail List provided as a service by IPC using LISTSERV 15.0

	To unsubscribe, send a message to [log in to unmask] with following text in

	the BODY (NOT the subject field): SIGNOFF Technet

	To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)

	To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest

	Search the archives of previous posts at: http://listserv.ipc.org/archives

	Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815

	-----------------------------------------------------

	

	






ATOM RSS1 RSS2