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Date: | Thu, 18 Sep 2008 08:12:23 -0500 |
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On those types of components, the copper ball shows up like a void. If
you have a good X-ray and you turn up the magnification, the "void" is
actually a light shade of gray, but not as white as a real void.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Genny Gibbard
Sent: Wednesday, September 17, 2008 6:01 PM
To: [log in to unmask]
Subject: [TN] Copper BGA balls
Anyone have experience with components using a tinned copper ball
instead of a SAC alloy solder ball?
Have you ever X-rayed one?
We are seeing voiding that does not meet the IPC-7095B spec for incoming
inspection with a transmission x-ray. However, we don't know if this is
a concern for this type of ball, or if this spec even applies to this
type of ball. I don't think these are meant to collapse and mix with
the solder on the board, like a normal solder alloy ball might.
Once again, thanks in advance for sharing your knowledge.
Genny
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