if ground plane sink additional heat in the PCB, you might have  
insufficient reflow at particular location.... just a thought...jk
On Dec 18, 2007, at 10:24 PM, Werner Engelmaier /* wrote:

> Hi Tom,
> Maybe the pin location are not that random. With the exception of  
> P16, they
> may all be at the outline of the die—I do not know your die size,  
> but I am
> guessing. You did not give a thermal history; is it possible that  
> you have
> creep-fatigue failures?
> 214.5 certainly should be sufficient for proper wetting of eutectic  
> SnPb, if
> you have solderability.
> In order to find out, you need to sacrifice some of your product to
> cross-sectioning.
>
>
>
> Werner
>
>
>
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