For crimp connections a pull test may not be the best mesurement. We
measured crimp height and crimp tool pressure. These proved that the correct
wire was installed, no insulation was in the crimp and resulted in
connections that always passed pull tests. AMP has specifications for both
crimp height and crimp pressure. I don't know other brands but the logic
behind these measurments is, IMHO, sound.

As far as ISO 9000 and process validation I don't see where they require
cross-sections (not that they are a waste of time) Couldn't you validate the
process output by comparision to industry acceptabitliy standards . . .
IPC-A-610C for example?

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610) 362-1200 x107
Fax: (610) 362-1290



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Phil Nutting
Sent: Friday, June 22, 2001 1:02 PM
To: [log in to unmask]
Subject: [TN] Process Validation


Hi all,

As part of our ISO-9001 effort we need to validate some of our processes.
Specifically wave solder, crimping, pwb cleaning and encapsulating.  Did I
miss any?

To validate wave solder do I need to micro-section a sample board and look
at it with a microscope or SEM?  If I have to micro-section a "sample"
board, how do I do that without destroying the pad I'm cutting through?  Yet
another piece of equipment?

For crimps it would be a pull test.  Any equipment suggestions?

For PWB cleaning it would be an ionic test.  What equipment would be used?

For encapsulation it would have to be a destructive test to saw it apart and
inspect the cross section and maybe a hardness test to confirm that the
ratios provided the proper cure hardness.

I'm open to suggestions.  Keep in mind that management will laugh if I bring
in requisitions for hundreds of thousands of dollars.  We like the "keep it
simple" approach.

Thanks in advance.

Phil Nutting
Manufacturing Engineer
Kaiser Systems, Inc.

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