Thanks Dave,
Do you have any data regarding reliability issue as a function of Silver contents? Or what is the maximum Silver contents that you can define as "safe"?
Thanks,
Gil
From: David Hillman [mailto:[log in to unmask]]
Sent: Wednesday, March 6, 2019 4:45 PM
To: TechNet E-Mail Forum <[log in to unmask]>; Gil Zilber MTH <[log in to unmask]>
Subject: Re: [TN] [External] [TN] SnAg component finish with SnPb solder past
Hi Gil - Sn62 solder which contain 2% silver content, was originally used to slow down the diffusion of silver containing component termination finishes. Silver diffuses very quickly into solder and having some silver content in the solder alloy itself modifies those diffusion kinetics. The introduction of copper or nickel barrier layers on component terminations reduced/eliminated the need for this technique. The addition of silver does slightly improve the reliability of solder joints but the cost of silver in the solder alloy can be a negative for many companies. Bottom line - unless you have a large input of silver (XX%) into a solder joint, silver will not result in solder joint integrity degradation.
Richard - any additional thoughts?
Dave
On Wed, Mar 6, 2019 at 8:11 AM Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Hi Richard,
One more question. You said, "But in this case using Sn62 would add another 1% of silver to the solder joints and you would not want that." What is the reason? Can I understand that components that have higher Silver contents in their surface finish could have a reliability issue?
Regards,
Gil
-----Original Message-----
From: Stadem, Richard D [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, March 6, 2019 3:53 PM
To: Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]>>; TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>
Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
I don't think so. Sn62 would be better if the part was being soldered to a surface that is sintered silver, to help limit leaching of the sintered silver surface. But in this case using Sn62 would add another 1% of silver to the solder joints and you would not want that. I would use Sn63.
-----Original Message-----
From: Gil Zilber MTH [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, March 06, 2019 7:47 AM
To: Stadem, Richard D; TechNet E-Mail Forum
Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
Thanks Richard,
I was hesitated only because of the Silver. Will it be better to use Sn62 and not Sn63?
Thanks,
Gil
-----Original Message-----
From: Stadem, Richard D [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, March 6, 2019 3:16 PM
To: Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]>>; TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>
Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
Gil,
I don't really see an issue with soldering that part. It is basically a SOT89 package with compliant leads and a large bottom pad. There would be plenty of solder volume to absorb the small amount of silver, and the part is not going to be affected by huge delta Ts as it is quite small. Nothing jumps out at me that indicates a potential issue. We solder lots of those and I have not seen any problems. You may see some voids in an X-ray because of the large flat pad, but they do not typically pose any reliability issue. Is there anything that is making you hesitate?
Odin
-----Original Message-----
From: Gil Zilber MTH [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Wednesday, March 06, 2019 1:50 AM
To: Stadem, Richard D; TechNet E-Mail Forum
Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
Hi,
It is a monolithic amplifier (GVA-84+ from mini-circuits) case style: DF782 Thanks, Gil
-----Original Message-----
From: Stadem, Richard D [mailto:[log in to unmask]<mailto:[log in to unmask]>]
Sent: Tuesday, March 5, 2019 8:39 PM
To: TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>; Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]>>
Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
What type of component is it?
-----Original Message-----
From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf Of Gil Zilber MTH
Sent: Tuesday, March 05, 2019 11:40 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] [External] [TN] SnAg component finish with SnPb solder past
Hi dave,
It is 1-3% silver.
Thanks.
Gil
-------- הודעה מקורית --------
מאת: David Hillman <[log in to unmask]<mailto:[log in to unmask]>>
תאריך: 4.3.2019 23:12 (GMT+02:00)
אל: TechNet E-Mail Forum <[log in to unmask]<mailto:[log in to unmask]>>, Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]>>
נושא: Re: [External] [TN] SnAg component finish with SnPb solder past
Hi Gil - what is the composition of the SnAg plating?
Dave Hillman
Collins Aerospace
[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>
On Mon, Mar 4, 2019 at 9:23 AM Gil Zilber MTH <[log in to unmask]<mailto:[log in to unmask]><mailto:[log in to unmask]<mailto:[log in to unmask]>>> wrote:
Hello,
Does anyone know if there is an issue of soldering components that have SnAg finish with SnPb solder paste?
Thanks,
Gil Zilber
Process Engineer at IAI
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