agree. any product used required good qualification, especially with
all different mask materials and cure, storage (age of the board)
variation...(shelf and floor life)
thx.
jk
On Jun 16, 2020, at 12:57 PM, Wayne Thayer wrote:
> Hi Joyce-
>
> Whatever is used, the adhesion criteria I listed previously must be
> validated. If I were to attempt this, I think I'd try a moderately
> aggressive plasma clean to the bonding surfaces involved--that
> would help
> with underfill wicking as well as adhesion. I can tell you that
> when you
> get those "solder squirt" short circuits, it is not a good day!
>
> Wayne Thayer
>
> On Tue, Jun 16, 2020 at 3:53 AM Yuan-chia Joyce Koo <[log in to unmask]>
> wrote:
>
>> is this close enough? https://www.indium.com/technical-documents/
>> other-documents/download/495/
>> indium also has no residue flux for flip chip - you might be able to
>> use it without cleaning prior to underfill. it is not the same thing
>> as one step, but possibly the best for two steps ;-).
>> fyi only.
>> jk
>> On Jun 15, 2020, at 11:16 AM, Richard Kraszewski wrote:
>>
>>> I have a potential need for a reflow encapsulant for a BGA
>>> Had reached out to Henkel but was informed that they had
>>> discontinued that product line.
>>> Anyone have a different source?
>>>
>>> Rich Kraszewski
>>> Senior Staff Process Engineer
>>> Plexus
>>>
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