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Subject:	Re: BGA land pattern design for .65mm pitch device
From:	"Croslin, Robert" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Wed, 5 Feb 2003 08:53:45 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (45 lines)

Jack, you might try SMT Plus - http://www.smtplus.com

Bob Croslin
Nielsen Media Research


-----Original Message-----
From: Jack McNally [mailto:[log in to unmask]]
Sent: Wednesday, February 05, 2003 7:53 AM
To: [log in to unmask]
Subject: [TN] BGA land pattern design for .65mm pitch device


Can anyone tell me where I can find land pattern design guidelines for
BGA's with .65 mm pitch? IPC-SM-782 only has pad dimensions for BGA's of
1.0 mm and greater.
I am placing a BGA which Hitachi calls its BP-240A package. The pad design
on the boards seems too small, only .0098" while the ball size according
to the spec is .0157".

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