Thank you Susan for "plugging" our work. I was just about to say the same
thing.There has been a lot of work on trying to classify the method whether
it be plugging,filling and/or capping and the various things that you be
worried about.
Dewey

> -----Original Message-----
> From: Susan Mansilla [SMTP:[log in to unmask]]
> Sent: Monday, March 22, 2004 7:58 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Plugged Via bubble
>
> There is an IPC committee D-33d Via Protection that has some
> information/guidelines  ina type of user's guide for via fill along with
> via protection.  You
> can pick up the latest strawman we are working on at their committee page
> on
> the IPC website.
>
> Later this week there is a teconf to establish what attributes should be
> included in
>  industry user's guide as well as to initiate a round robin testing plan
> for
> developing acceptance criteria.   Currently there is a listing of various
> different acceptance criteria different companies use.
>
> Last week when we were talking about solder voids in vias, Werner
> cautioned
> that these could present a real realiability issue, but voids in fill
> materials
> and conductive fill materials did not pose the same reliability problems.
>
> Please let John Perry know if you would like to join D-33d in its' efforts
>
> and stay tuned to learn how you can help and benefit from the effort.
>
> Susan Mansilla
> Robisan Lab
>
>
>
>
>
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