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Date: | Thu, 21 Apr 2005 08:34:53 -0500 |
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I would think his comment "pulling away from the foil" would rule out the
need for peel strength test. I've never seen conditions that have caused
plated copper peeling show up in microsection, of course I've never viewed
them over 200X...and it's been my experience angstroms thick passivation
contaminates are not viewable in most in-house labs.
Where I would begin is water break on the foil panels before and after
electroless copper, perhaps experiments involving cleaning and microetch to
determine where (on raw foil surface, or during/post electroless copper) the
condition is occuring.
Franklin
----- Original Message -----
From: "Jeffrey Bush" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, April 21, 2005 7:51 AM
Subject: Re: [TN] Peeling Copper traces
If the failure is plating to foil you will need to do a microsection to
identify the failure mechanism - foil to dep, dep to plate, etc. If the
failure is foil to base material you will need to assess that raw
material lot for peel-strength.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: Rich Olsen [mailto:[log in to unmask]]
Sent: Wednesday, April 20, 2005 4:51 PM
To: [log in to unmask]
Subject: [TN] Peeling Copper traces
Hello,
What are some likely causes of peeling copper traces?
It is plated copper pulling away from the foil copper?
thanks,
Rich
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