My rule of thumb is ...  shear a ball off (using tweezers and a rocking
motion), if solder remains on the component, it's good, if some solder
remains and some base metal is present, it's marginal, if no solder remains,
it's NG.  Not very scientific, but it's a start.

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   [log in to unmask] [SMTP:[log in to unmask]]
        Sent:   Tuesday, March 19, 2002 12:29 PM
        To:     [log in to unmask]
        Subject:        [TN] BGA Solder Ball Shear

        Are there any standards or rules to apply to shear strength of BGA
        solderballs.  What is considered good or bad, etc.?

        Thank You,

        Dennis Fall
        Process Engineering Supervisor
        Thin Film Technology Corporation
        North Mankato, MN 56003-1702
        Email: [log in to unmask]
        Phone: 507-625-8445
        Fax: 507-386-9269


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