Good afternoon, Technet...
We're considering using Rogers TMM-6 material for an RF design which would
include multilayers (4) of TMM and multilayers (4) of Polyimide with both blind
and through vias. Does anyone, preferably both fabricators and assemblers,
have any experiences with this material? Any fab or assembly problems? Please
advise...
Thanks,
Jim Marsico
AIL Systems Inc.
(516) 595-5879
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