Steve, I can't seem to access http://www.thermalworks.com
<http://www.thermalworks.com> .  Is the address correct?
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

        -----Original Message-----
        From:   Stephen Gregory [SMTP:[log in to unmask]]
        Sent:   Friday, January 11, 2002 7:37 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] VIAS PLATED CLOSED

        Hi Jim!

        Have you looked into using Stablcor as the substrate for your
assembly to dissipate heat? We're looking into using this, it transfers heat
at a rate 1000 times faster than FR4 material. Go to:

        http://www.thermalworks.com

        -Steve Gregory-

        Peter, thanks for the response.




                Let me try to explain further.  We're using ceramic leadless
chip carriers
                which give off a lot of heat.  In an effort to dissipate the
heat to the
                ground planes, we're placing thermal vias underneath.  We
wanted the thermal
                vias to be plated closed, resulting in a solid plug of
copper, which we then
                can deposit solder paste on top which would contact the
bottom of the
                ceramic package.  The heat path would be from the component
through the
                solder bumps on the thermal vias through the solid copper
via.  Our board
                supplier claims that he can plate the vias closed, but when
I asked about
                voids and entrapped plating chemicals, he said he was never
asked that
                before and would have to look into it.  I'm getting
concerned with this
                design, thinking that an epoxy-filled via which is plated
over on top would
                be better.  I now need recommendations for a THERMALLY
conductive adhesive,
                it doesn't have to be electrically conductive but I don't
really care.

                Thanks again,

                Jim Marsico
                Senior Engineer
                Production Engineering
                EDO Electronics Systems Group
                [log in to unmask] <mailto:[log in to unmask]>
                631-595-5879







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