Dave,
Horror! Yep, will wait until Monday. Beer, very good idea! I have some
bottles of special Xmas beer, dark and with much taste of malt. I feel
thirsty now, your fault.
Inge
-----Ursprungligt meddelande-----
Från: TechNet [mailto:[log in to unmask]] För David D. Hillman
Skickat: den 4 maj 2007 22:45
Till: [log in to unmask]
Ämne: Re: [TN] Metalurgists, need assistance
Hi folks and thank you Steve for being "TechNet Picture Central"! Sorry
but just to warn everyone but I am going to use the "B" word shortly.
Inge
- take a close look at picture 4. As Werner pointed out the gold is
non-wetting the nickel in number of locations. What really jumped out
at
me is that "mud flat" appearance on some of the nickel surface regions -
a
"mud flat" appearance is a classic indication of black pad! I recommend
you complete a cross-section to confirm that you have nickel grain
boundary attack.
But since it is Friday, go have a beer and worry about this on Monday!
Dave Hillman
Rockwell Collins
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Steve Gregory <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
05/04/2007 01:45 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
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Subject
Re: [TN] Metalurgists, need assistance
Hi Inge!
Got your pictures posted. Took me a bit, I was swapping our wave
solderpot from 63/37 to HMP. Done now. I'm getting quicker, I can do it
in 20-minutes now. Took me about 45-minutes when I first did it...
Anyways, here's the links:
http://stevezeva.homestead.com/files/Pic1.jpg
http://stevezeva.homestead.com/files/Pic2.jpg
http://stevezeva.homestead.com/files/Pic3.jpg
http://stevezeva.homestead.com/files/Pic4.jpg
http://stevezeva.homestead.com/files/Pic5.jpg
http://stevezeva.homestead.com/files/Pic6.jpg
-Steve-
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Hfjord
Sent: Friday, May 04, 2007 12:22 PM
To: [log in to unmask]
Subject: [TN] Metalurgists, need assistance
Have an issue with (randomly) lifted FPGA leads.
Pic 1: good joint after pull test
Pic 2: ditto but high magnification
Pic 3: "rotten" joint after pull test
Pic 4: ditto but high magnification
Pic 5: "rotten" cross section
Pic 6: ditto but high magnification
60Sn on ENIG, obviously a brittle region. Suspect Kirkendall voids, but
the pockets with zillions of Tin spheres (0.1 to 2 um in size) points at
insufficient peak temperature to make 100% melt and good solidifying. If
these little balls were Lead, I could understand, but they are Tin!
Never seen like. Any "quickhead" out there, need fast advice.
Note: Pic 2, you can see the underlying board pad nickel as dark areas.
An experienced analyst will hopefully recognize. No Phosphorous peaks!
My Friday headache.
Inge
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