Richard,

Check out the Jedec J-STD-033 ( http://www.jedec.org ). Level 6 parts are
listed as requiring a mandatory bake prior to reflow. Moisture barrier bags
and humidity indicator cards are listed as optional. My interpretation of
this is that while you may want to seal the parts for other reasons, such as
maintaining lead solderability, it's not required for moisture sensitivity
reasons alone.

Regards,


Rick Thompson
Ventura Electronics Assembly
2665A Park Center Dr.
Simi Valley, CA 93065

+1 (805) 584-9858 voice
+1 (805) 584-1529 fax
[log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of <Richard Tilbrook>
Sent: Friday, October 08, 1999 12:37 AM
To: [log in to unmask]
Subject: [TN] level 6 moisture sensitive smt components


Hi,

I am enquiring into the acceptable conditions [ie. temp. and Relative
Humidity] for long term storage [ie. 8 to 10 months] of level 6 moisture
sensitive smt components.

I am aware that moisture sensitive components of levels 2 through 5 require
an RH of less than or equal to 20% RH for long term storage, but does this
apply to levels 5a and 6, or is a lower RH necessary? I ask as I have no
level 5a information to check on, and level 6 information is individual to
the component.

Thankyou for taking the time to read this,

Regards,

Richard Tilbrook,
Junior Engineer,
British Aerospace.

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