Joyce,

Asking this for a friend that is already distant from the party in need so I
am very handicapped when it comes to needed details.  I am used to having
this ability in-house so am a bit confused as to why they don't, but ... I
will ask the questions anyway....

It is likely automotive, so I would likely rule out Au plating.  I don't
know the wedge bonder involved, but assume it is a 120KHz transducer.  All
of those details would have to be laid out, along with the CAD model.  I
already suggested that they go back to the equipment mfr for some degree of
assistance.

I've experienced issues related to mold flash and mold release and all the
issues they cause when your back is turned on the supplier.  Why some lots
have problems and others don't.  It's enough to make you pull your hair out
when a molder has no concept of what 'just a little more' mold release can
do, etc...

I don't know if the leads are cantilevered in from the side of the package,
or up through the base, or what their configuration or dimensions are.
Sometimes a 'look' will tell a great deal, but I am unlikely to get that
either.

Depending on their degree of distress - finding an answer can be worth a
great deal!

Thanks for everyone's inputs thus far [Vlad, Stewart, Joyce]!  

Keep 'em coming!

Steve C

-----Original Message-----
From: Joyce Koo [mailto:[log in to unmask]] 
Sent: Friday, March 21, 2014 9:31 AM
To: [log in to unmask]; 'Steven Creswick'
Subject: RE: [TN] Failure Analysis Labs for Heavy Wire Bonding Issues

Al bond on Ag spot plated leadframe?  Or gold plated leadframe?  You need
more just FA, you need know bonding machine and frequency, etc. etc.  a
process development on its own... better not on a product...(a bit late if
it is done on product - very costly... you must have deep pocket for Vlad
;-)

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Friday, March 21, 2014 8:36 AM
To: [log in to unmask]
Subject: [TN] Failure Analysis Labs for Heavy Wire Bonding Issues

Good morning everyone!

Hoping someone can help on this somewhat unique situation - 

A party is performing heavy wire Al bonding of 12 & 20 mil wire between a
PWB and the leads of an over-molded package.  

They are looking for an outside lab to perform testing/failure analysis in
an attempt to determine the root cause/s of frequent bond misses.  (It
appears they have minimal analysis capability in-house.)

The first things that I think of with heavy wire Al bonding issues are
insufficient clamping during bonding, mold flash on the leads, mold release
on the leads, and lead oscillation (harmonics) during bonding.

Does anyone know of a good failure analysis lab that can provide these
services?  The company is located in the central US, but ultimately, the lab
can be anywhere.

Two possible that come to mind are:

Foresite Labs - http://www.residues.com/

Constellation Technology, in Largo, Florida - http://www.contech.com/

Anyone have others??


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883




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