Hi Leo,
I am afraid you might be stuck with (2); for 2 reasons.
(1) I do not see 'resin recession' in either via barrel walls [IPC documents
except after soldering processes] ir burried (thermal) vias as a reliability
risk--where is the risk?;
(2) no matter what you do, the adhesion will likely never be enough; you
could fill the filling resin more to get its CTE closer to Cu.
Werner
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