Dear Technetters:
Since this question could not be raised on "How It's Made" I thought we would pose it here:
We have recently come across a few QFN packages where there are raised pads (about 3 mils from the bottom surface of the QFN) on the bottom of the device.
Our questions are related to the following:
How are these "raised bump" leadless packages fabricated such that these bumps are raised to a different z axis plane then the bottom surface of the device?
Regards
Bob Wettermann
PH 847-767-5745
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