Seems to be a fine (less than 1 mm pitch) BGA. People are assembling such
parts with many many more bumps (tens to hundreds of bumps). One necessary
advice I have seen worthy of note is that do not tweak placement manually
before reflow.

Syed.

        -----Original Message-----
        From:   [log in to unmask] [SMTP:[log in to unmask]]
        Sent:   Wednesday, July 15, 1998 12:32 PM
        To:     [log in to unmask]
        Subject:        [TN] Assembly unusual part?

        All,

        I have received a request from a customer to install an unusual
package on
        their board.  The package dimension is .85mm x .85mm (yes,
millimeters) with
        four solder bumps.  The solder bumps is .16mm - .18mm in diameter
with a .5mm
        pitch.
        The part is .78mm thick.  The material is silicon.

        Question 1:  What do you call this type of package?

        Question 2:  Is there a recommended assembly process?

        Here is my plan of action:

        1. Get data on the type of solder bump
        2. Use sticky flux and not paste to print
        3. Use Machine or hand mount the component
        4. Use X-ray to inspect for misaligment
        5. Reflow and X-ray

        Thank you for your input!

        Tuan

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