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Date: | Mon, 14 Apr 97 10:02:50 cst |
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Hi Phillip -
Kirkendall voiding is a diffusion type phenomena that typically
involves gold finishes. The diffusion of the gold molecules occur so
fast that the diffusion physics become one sided and material can not
diffuse fast enough to replace the vacated gold molecule locations.
This results in voids and since Kirkendall first discovered/proposed
the diffusion mechanism his name has become associated with the
phenomena. Take a look at "Feinstein and Bindell, The Failure of Aged
Cu-Au Thin Films by Kirkendall Porosity, Thin Solid Films 62, pg 37-47
1979" - it may be a helpful reference. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Kirkendall Void
Author: [log in to unmask] at ccmgw1
Date: 4/11/97 11:25 PM
I've been stumped by a phrase which one of our Japanese customers used in a
correspondence with us recently. The phrase is "Kirkendall void" and the
context it was used in is:
"There are some electrode that are gold plated and also solder welded. If
there is gold at solder welded part, Kirkendall void may be formedm
resulting pealing."
It is possible that the CCA they were looking at has gold plated leads
installed on gold plated PWBs and reflowed with Sn63Pb37 solderpaste.
Any help would be gratefully accepted,
Regards,
Phillip A. Bavaro
Senior Manufacturing Engineer
[log in to unmask]
(619) 658-2542
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