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October 1999

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Subject:
From:
Timothy Reeves <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 16 Oct 1999 11:45:08 -0700
Content-Type:
text/plain
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text/plain (54 lines)
as Steve Gregory kindly pointed out off-line, those "deg C" should read "deg
F"....how embarrassing since I pointed out on this very forum the importance
of using correct units, a la NASA.. Darn spelling checker doesn't catch
incorrect physical constants!

> ----------
> From:         Timothy Reeves
> Sent:         Friday, October 15, 1999 5:08 PM
> Subject:      Re: Tin content of HASL
>
> Jack,
> I'd be surprised if your board supplier was really paying attention to
> that.. I mean does anyone have a HASL machine set up with Sn70 solder? You
> probably got Sn63..the standard HASL solder.
> Also, the liquidus for Sn70 is only 378 deg C (vs. 361 deg C for Sn63). It
> doesn't seem like that would stay solid in your selective soldering
> process
> without very tight temp. control.
> Tim Reeves
>
> > ----------
> > From:         Jack Olson
> > Sent:         Thursday, October 14, 1999 5:34 PM
> > Subject:      Tin content of HASL
> >
> > I've just noticed that our fab notes call for 70% Tin 30% Lead on Hot
> Air Solder Level.
> > This only struck me as odd because at a previous company we used SN70 as
> a
> > high temperature solder (I think) for terminal posts, so it wouldn't
> reflow
> > when we soldered wires to it using SN60 or SN63.
> > Is it more appropriate to use SN60 or SN63 for HASL?
> > Is there some advantage to using SN70?
> > (Sorry for the cross-posts, but this affects FAB and ASSY as well as
> DESIGN)
> >
> > Thanks in advance,  Jack
>

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