Jack,
IPC does not really encourage the use of their Guidance documents or 
Handbooks as "specifications", though I have seen the darndest things 
called out in customer requirements. 

What I would recommend is that your specs recommend using the practices 
found in 1601.  If you want things like bake time or storage conditions as 
requirements, they should go into the procurement documents as line items 
separate from the 1601 references.

Doug Pauls



From:   Jack Olson <[log in to unmask]>
To:     <[log in to unmask]>
Date:   11/20/2012 03:35 PM
Subject:        Re: [TN] FAB: Humidity Limits?
Sent by:        TechNet <[log in to unmask]>



oops... I'm really embarrassed! 

I thought I was familiar with IPC-1601 (the packaging and storage part of 
it anyway)
which is why I was searching EVERYWHERE ELSE for fabrication info, but now 
I discover
that IPC-1601 discusses fabrication too.

I'm sorry for not doing enough homework first.

but if I could ask one question about it, I only have the Final Draft of 
the document and
it is labelled as a "Guideline", but gives real recommendations such as 
specific baking
parameters for various situations. 
My question is, can (or should) board purchasers REQUIRE adherence to 
1601? 
Can we even do that (like with notes on a drawing) if the document is just 
a guideline? 

thanks,
Jack

.

On Tue, 20 Nov 2012 13:28:07 -0600, Jack Olson <[log in to unmask]> wrote:

>After reviewing the bare board packaging and shipping recommendations in
>IPC-1601 (which addresses getting the boards from the fabricator to the
>assembler) the question came up about the humidity levels INSIDE the
>fabricator DURING the fabrication.
>Does IPC address that? Maybe I haven't had enough coffee today, but a
>search for "moisture" or "humidity" in IPC-6012, IPC-A-600, etc didn't
>reveal very much useful info. Are we trying to control that? Or just the
>moisture level in the finished product?
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