TECHNET Archives

January 2002

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 23 Jan 2002 11:36:34 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (116 lines)
Hi, Steve,

We ran into the same problem (more or less) - thermal management
requirements and solutions conflicted with the VME spec (which spec did you
go with, by the way?).

One solution we considered, but didn't implement owing to expense, is to
"step" the PCB so that it's the right thickness at the card guide edges and
at the P1/P2 connector areas. Is that possible with Stablcor? - I don't
know. Makes routing traces to the connectors a bit circuitous too (pun
intended). The board thickness outwith these areas is not important, as
long as it, plus the component height, doesn't exceed the envelope max.

You'll need some pretty light-weight copper and very thin separation layers
to fit 16 layers into the spec'd thickness. Good luck!

Peter




                    Stephen
                    Gregory              To:     [log in to unmask]
                    <SteveZeva@AO        cc:     (bcc: DUNCAN Peter/Asst Prin Engr/ST
                    L.COM>               Aero/ST Group)
                    Sent by:             Subject:     [TN] VME stuff again...
                    TechNet
                    <[log in to unmask]
                    ORG>


                    01/23/02
                    10:41 AM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum.";
                    Please
                    respond to
                    SteveZeva






Hey all ya'll!

VME stuff again. Pretty strict standard. Gotta new technology out there
called Stablcor from Thermalworks, problem that we're seeing is that board
thickness is going to increase, which violates the VME spec's. Not just
from
the card-guide aspects, but will change the dimension where the P1 and P2
connectors interface with the backplane on a standard VME card cage.

Just wondering if anybody has anything out there (connectors, etc.), that
will allow you to "shoe-horn" ten-pounds, inna 1-pound bag, that will
comply
with VME  spec's.

This board is 16-layers, within .063" without Stablecor, if we use 2-layers
Stablcor, it will increase .020-.025", with 3-layers Stablcor (the best, as
far as thermal dissapation and CTE solutions), it will increase .030-.035".

This Stablcor material sounds like a really good solution for thermal and
CTE
solutions, but has a hard time staying within the dimensional spec's that
are
called out in the VME spec's...trying to change these spec's I know is an
act
of God...it's there, and it's done.

Just wondering if anybody else has explored this material, and have come to
a
dead-end like I have....because of the reasons like I have.

-Steve Gregory-

---------------------------------------------------------------------------------

Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]:
SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
---------------------------------------------------------------------------------





[This e-mail is confidential and may also be privileged. If you are not the
intended recipient, please delete it and notify us immediately; you should
not copy or use it for any purpose, nor disclose its contents to any other
person. Thank you.]

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2