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August 1999

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Subject:
From:
Kenny Bloomquist <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Aug 1999 15:38:54 -0700
Content-Type:
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text/plain (42 lines)
ANSI/J-STD-001 basically says that gold plated through hole and surface
mount components need to be cleaned by solder dipping or wave.

My question is, are there any guide lines for soldering wires to gold
plated pierced or perforated terminals (plating thickness is unknown).
These are typically very small (thin) and there is a wire going through the
hole that doubles back on its self. This is soldered with a goodly amount
of solder.

Any problem?

Ken Bloomquist
Sr. Principal Process Engineer
PRIMEX Aerospace Company
P.O. Box 97009
Redmond, WA 98073-9709
http://www.primextech.com

Ph:   425-885-5000
FAX: 425-882-5786
[log in to unmask]

Northcon/2000, Board Member
http://www.northcon.org

Electronics Manufacturers Association (EMA), Vice President
http://www.ema-wa.org

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