I am looking for any experience that anyone might have on Nippon Chemical's
WPS-80 (P-3) solder mask.  We are having some difficulty having an epoxy
underfill material wet to boards masked with this material.  I would be
interested in any information that anyone might have regarding the surface
energy of this solder mask as well as any other information related to
applicability of the material for flip chip assembly applications.

Thanks in advance for any assistance in this matter!

Ted Tessier

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