It should be possible but, we would be messing with a very important process
step in your manufacturing cycle. We may be able to help but we would need
much more information. Please call the EMPF Helpline. 610 362-1320
Guy Ramsey
American Competitiveness Institute
One International Plaza Suite 600
Philadelphia PA
610 362-1200 ext. 107
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of My Nguyen
> Sent: Wednesday, January 16, 2002 1:17 PM
> To: [log in to unmask]
> Subject: [TN] Way too many Product Oven Profiles
>
>
> Good morning Techneters,
>
> I am working on oven profiler consolidation project.
> Currently, we have 540 Product Profile for each oven.
> For 13 oven machine, we have 7020 profiles. That is
> way too many for a memory manufacture!
>
> We currently use water-soluble solder and no clean
> solder. We know that for each product, the pre-heat
> zone, soak-zone, re-flow zone, and temperature could
> be a bit different from one Solder Paste Manufacture
> to other, or from one Solder Paste type to others, or
> even from single side, to double side.
>
> HOWEVER, for memory, the width, length, thickness, and
> number of ICs, resisters, capacitors, and others are
> limited to a certain number, i.e, PCB height is less
> than 1.7 inches; PCB thickness is equal or less than
> 0.05 inch; PCB length follow the spec. of 5.25” for
> DIMM, DDR, RIMM, 2.66” for SODIMM, 4.25” for 72 Pin
> SIMM, etc.
>
> I have heard that out there, there is a way to reduce
> from 1000s down to 10-100 oven profiles based on
> Mass/Density. And of course, there are many other
> scientific ways that I have not heard of. Please help
> me! What would be the best method you recommend or you
> have successfully tried to reduce the number of oven
> profiles down to a control/reasonable numbers?
>
> Your advice and suggestion are greatly appreciated.
>
> Stacy
>
>
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