Of course first success is best but variations in manufacturing i.e. machine
placement, solder deposition, conveyor transport, handling, moisture,
inconsistencies in ball manufacturing all can lead to misplacement or poor
soldering. That being said, in 1 year of BGA and leadless component placing
here we have had to replace only two BGA's for obvious misalignment at
placement. However we still must use X-Ray inspection and other tools to
verify our process.

Correct stencil design, board layout with correctly defined pads and a good
screen printer with vision acceptance are required to statistically reduce
the number of potential errors.

Dave Chapman
Circuit Service, Inc.
 -----Original Message-----
From:   Weisz Ervin [mailto:[log in to unmask]]
Sent:   Tuesday, November 19, 2002 3:16 PM
To:     [log in to unmask]
Subject:        [TN] BGA Rework

Dear Technetters,
I see many messages regarding BGA rework. Now, I have
a rather annoying question to you guys at the
assembly.
Is the rework of BGAs a real "must". Why isn't it
possible to assemble BGAs "right the first time"?
Or, am I wrong and rework does exist but is needed
only on a small minority of all BGAs assembled.

Could someone clear up this issue for me ????

Best regards,
Ervin Weisz


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