Hi Tan
You ask if the risk is minimum - how will we know? You have a mix of
chemistry that will be exposed to variations of both temperature and
humidity whilst under electrical bias - ask yourself, will anyone die
if the end product fails or will I lose my job?
If you answer no to both of these, no problem. On the other hand, you
might want to ask a few more questions to get an acceptable answer.
Graham Naisbitt
On 1 Jul 2008, at 16:50, Tan Geok Ang wrote:
> Thanks, now I got you point. With the peelable mask applied on just
> the IC moulding compound (which will be the last item to be coated),
> is the risk at minimum/ should not be a issue?
> Once, again thanks!
>
> ________________________________
>
> From: Graham Naisbitt [mailto:[log in to unmask]]
> Sent: Tue 7/1/2008 11:36 PM
> To: Tan Geok Ang
> Cc: TechNet E-Mail Forum
> Subject: Re: [TN] Solithane coating dewetting
>
>
>
> Tan
>
> It is not a reaction with the Solithane coating that I would worry
> about, it is the possibly harmful effects from the residues of the
> mask on the actual circuit performance - exacerbated by the presence
> of a hydrophilic coating.
>
> Graham Naisbitt
>
> On 1 Jul 2008, at 13:02, Tan Geok Ang wrote:
>
>> I do agreed different chemicals react differently between them, so
>> far the peelable that we are doing does not react with Solithane
>> 113/113-300. Thank for the advice which is always a point to
>> consider.
>>
>> ________________________________
>>
>> From: TechNet on behalf of Graham Naisbitt
>> Sent: Tue 7/1/2008 5:54 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] Solithane coating dewetting
>>
>>
>>
>> Tan
>>
>> Be careful - peelable masks often contain ingredients that remain
>> behind after removal and that can lead to unfavorable reactions.
>>
>> Graham Naisbitt
>>
>>
>> On 27 Jun 2008, at 07:46, Tan Geok Ang wrote:
>>
>>> Currently, I will apply some peelable mask over those "problematic"
>>> IC
>>> moulding, the dewetting is minimised. Just want to find out the
>>> cause of
>>> the problem. Thank for the advice!
>>>
>>> -----Original Message-----
>>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
>>> (EHCOE)
>>> Sent: Thursday, 26 June 2008 10:10 PM
>>> To: [log in to unmask]
>>> Subject: Re: [TN] Solithane coating dewetting
>>>
>>> I agree with Doug, especially the part about somewhat agreeing with
>>> Graham (just kidding). Since these are the daze of outsourcing, I
>>> have
>>> had to give relief on the coverage requirement for non-conductive,
>>> non-critical surface areas of plastic parts due to the
>>> aforementioned
>>> reasons.
>>> Dewey
>>>
>>> -----Original Message-----
>>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas O. Pauls
>>> Sent: Thursday, June 26, 2008 5:30 AM
>>> To: [log in to unmask]
>>> Subject: Re: [TN] Solithane coating dewetting
>>>
>>> I somewhat agree with Graham. Nothing really likes to stick to
>>> silicones,
>>> including other silicones. I often have to address the challenge of
>>> conformal coating delaminating over a spot where RTV silicones had
>>> been
>>> dripped and then wiped up.
>>>
>>> I would suggest plasma etching, most likely oxygen and argon. A
>>> fairly
>>> short duration is often effective at solving coating adhesion issues
>>> in
>>> problem cases. Many of the mold release agents are either teflon
>>> or
>>> silicone based, so will be fairly chemically resistant. That is why
>>> the
>>>
>>> Ensolv may not be addressing it.
>>>
>>> Where I disagree with Graham is the approach of having the component
>>> manufacturer change their most release agent. If you are a Motorola
>>> or a
>>>
>>> Nokia, and going through a few million components a day, you might
>>> have
>>> a
>>> little leverage with the component manufacturer. Most of us just
>>> have
>>> to
>>> take what we can get and don't have the leverage necessary to get
>>> changes
>>> made.
>>>
>>> Doug Pauls
>>> Rockwell Collins
>>>
>>>
>>>
>>>
>>> Graham Naisbitt <[log in to unmask]>
>>> Sent by: TechNet <[log in to unmask]>
>>> 06/26/2008 06:05 AM
>>> Please respond to
>>> TechNet E-Mail Forum <[log in to unmask]>; Please respond to
>>> Graham Naisbitt <[log in to unmask]>
>>>
>>>
>>> To
>>> [log in to unmask]
>>> cc
>>>
>>> Subject
>>> Re: [TN] Solithane coating dewetting
>>>
>>>
>>>
>>>
>>>
>>>
>>> Silicone not sticking to silicone - no surprise.
>>>
>>> How to remove silicone? Not easy, maybe plasma etching or a really
>>> aggressive solvent.
>>>
>>> You need to get back to the component manufacturer and have them
>>> change their mold release or at least control how much they use.
>>>
>>> Graham Naisbitt
>>>
>>> On 26 Jun 2008, at 07:33, Tan Geok Ang wrote:
>>>
>>>> Hi All,
>>>> Quite often, I encountered Solithane coating dewetting
>>> issue
>>>> over some IC moulding (rough or smooth, did not trace what moulding
>>>> material is used) compounds across different suppliers, though the
>>>> whole
>>>> PCBAs are being cleaned with EnSolv. What is the cause of the
>>>> issue?
>>>> Is
>>>> the cause due to the release agent used during the moulding
>>>> compound
>>>> process (but why cannot be clean away)?
>>>> Thank in advance!
>>>> Regards
>>>> GA Tan
>>>>
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