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December 2006

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Fri, 1 Dec 2006 07:56:45 -0500
Content-Type:
text/plain
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text/plain (75 lines)
HASL the boards and give them solder over nickel - looks good and
solders fine.  The solder pot issue is hewey.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Robert Lazzara
Sent: Thursday, November 30, 2006 4:47 PM
To: [log in to unmask]
Subject: [TN] ENIG Risks

Dear TechNetters:

My company recently produced bare PCBs with ENIG finish for a client who
now wants HASL. I can't strip the ENIG and the routed PCBs are too small
for HASL processing (conveyor or dip).

Here's my client's concern:
1. ENIG will poison his solder pot.
2. ENIG will introduce risk of thru-hole component attachment failure

On the poison solder pot issue, my client will only assemble 100 PCBs
every
30-days. Each PCB has a total solderable surface area of 6.94 sq." At an
average measure of 4.05uI of gold I can't see the drag-in being an issue
of
concern. The small amount of gold introduced to the solder pot will
likely
be diluted into nothingness by solder replenishment across the next
30-days.

On the embrittlement issue, virtually everything I find in the TechNet
archives (and elsewhere) concerns SMT designs and applications. Here
again
the concern is with an all thru-hole design with no SMDs in the build.
If
it's important, the nickel thickness averages 118uI.

Q1: Is there a real risk to solder pot poisoning?

Q2: Is there a real risk that PTH components are going to unplug due to
embrittlement?


Your thoughts and opinions are appreciated -

Robert Lazzara
VP, Business Development
Circuit Connect, Inc.

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