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November 1997

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Subject:
From:
peter dahlen <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 24 Nov 1997 15:39:14 +0000
Content-Type:
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text/plain (62 lines)
Hi,

I would like to have some help to select material to a multilayer board and
also some
good ideas regarding how to design this type of board.

The board is a combination of material with 3 sheets of "microwave material"
and 6
sheets of Polyimide/glass. In total 6 Cu layers in the microwave part and 12
Cu layers in
the other part. We are now using Rogers Duroid/6002 material in the
"microwave part"
and standard 5mil Polyimide/glass in the other part.

The problem is to find a bond film or prepreg for bonding the microwave
sheets and this
with a pressing temperature and pressure in the same range as standard
material (FR4 or
Polyimide).  It is not necessary that is it the Rogers Duroid 6002, we can
also use other
material, but is shall have nearly the same technical data as the 6002 and
also that the
data/material are stabile in temperature.

The board shall be submitted for thermal cycling so the CTE shall be low or
similar to
Polyimide.

The board will also include blind via.

So if anyone have some experience in multilayer PTFE boards, I would like to
know the
following:

- Microwave material with the same technical data as 6002 to be used in a
multilayer

- Bond film or prepreg to be used in combination with above material, and
which can be
bonded in standard press-equipment's. Please also add temperature and pressure.

- Any recommendations to do this type of job.


Best Regards

Peter Dahlen
Saab Ericsson Space
Sweden

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