Steve,

It sounds like you are describing a separation between the base or vendor
copper and copper electroplated on top of that through a pattern plate
process.  This is the result of incomplete removal of the resist adhesion
system prior to pattern plating that interferes with the copper to copper
bond.  This is known in the industry as copper peelers.  This can be solved
in the PWB manufacturing process through more aggressive pre-plate cleaning,
particularly increased microetch.

Post manufacturing, the time honored method of addressing this issue is to
oven bake the boards.  This can been effective if the condition is not too
sever.

Jim Travis
Insulectro

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