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January 2017

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Subject:
IPC Standard, Thermal Header Attachment Devices, THAD
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 12 Jan 2017 13:46:07 +0000
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Fellow TechNetters:

    Is there any data out there regarding the integrity of a Thermal header Solder joint integrity over time.   Most THAD that I have x-rayed exhibit some degree of voiding.   Can the solder joint voiding degrade the solder connector to a point that it would result in a shorted device.

Victor,

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