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October 1999

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Subject:
Re: Surface Mount Adhesives
From:
pod <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Oct 1999 13:46:10 -0700
Content-Type:
text/plain
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text/plain (55 lines) 
Depending on its composition, cure, reflow temp/profile, Tg, etc., it
doesn't flow. I have seen adhesives invade already present cracks in chip
devices prior to reflow. Also, have seen adhesives invade solder joints in
same.

Earl Moon
----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, October 11, 1999 8:26 AM
Subject: [TN] Surface Mount Adhesives


> Hi All
> Does the "cured" adhesive used to secure surface mount components
> to the bottom - wave solder - side of a board flow during wave solder
> operations?
>
> I am trying to find out how/when the adhesive got inside the crack on a
> cracked
> resistor.  My impression was that the cured adhesive would not move????
>
> Susan Mansilla
> Robisan Lab
>
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