Dell - Internal Use - Confidential



Fellow TechNetters:



   Is there an consensus out there whether the gold finger edge on DDR3 DIMM Modules be beveled/Coined/Chamfer.   I would appreciate any comments/remarks on this topic.



Victor,



-----Original Message-----

From: Hernandez, Victor G

Sent: Wednesday, February 21, 2018 1:10 PM

To: TechNet <[log in to unmask]>

Cc: Hernandez, Victor G <[log in to unmask]>

Subject: FW: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



Fellow TechNetters:



   Any additional comments and/or concern over the gold finger edge being Beveled/Coined/Chamfered.   Many a times do I see socket with gold plated wire contact gouges from DIMM product that has not been beveled/Coined/Chamfered, even bent pins.



Victor,



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios

Sent: Wednesday, February 21, 2018 8:15 AM

To: [log in to unmask]<mailto:[log in to unmask]>

Subject: Re: [TN] DIMM Modules Gold Finger Edge - Bevel/Coined/Chamfer



I don’t know of a fully fledged std for it, other than workmanship acceptance criteria in 6012 and possibly mentions of design guidance in 2221



Sent from my iPhone



> On Feb 21, 2018, at 8:57 AM, "[log in to unmask]<mailto:[log in to unmask]>" <[log in to unmask]<mailto:[log in to unmask]>> wrote:

>

> Fellow TechNetters:

>

>   Does IPC still have a STD for the above stated processt?   If so, can someone direct me to the document.

>

> Victor,